先端半導体パッケージング・実装技術の研究開発動向

昨今、特に話題を集める半導体パッケージングですが、これに関連した数ある国際会議の中でも最も大きく最新の技術が発表されるのがECTC (Electronic Components and Technology Conference) です。 　今回のセミナーでは、半導体パッケージングの最新動向を紹介し、2023年6月に終えたECTC2023の中からチップレット/RDLインターポーザ/Siブリッジ/FOWLP 、およびハイブリッド接合を中心にハイライトを行います。ECTC2023の総発表件数379件 (ポスター127件含む) から70件の注目発表をピックアップして解説する予定です。

1. ECTCの紹介と最近の研究動向、および用語の説明
   1. ECTCの発表件数の推移や国別/研究機関別投稿状況
   2. 3D-IC/TSV技術 (Via-middle vs. Via-last, Wafer-to-Wafer vs. Chip-to-Wafer他)
   3. インターポーザの分類 (2.5D vs. 有機RDL vs. ガラス)
   4. CoWoS (Chip-on-Wafer-on-Substrate) とFOWLP (Fan-Out Wafer-Level Packaging)
   5. ハイブリッド接合の概要
2. チップレット/RDLインターポーザ/ブリッジ/FOWLP 13件
   • Session 1: Heterogeneous Chiplet Integration
     • Paper 1. Ultra High Density Low Temperature SoIC with Sub-0.5 μm Bond Pitch (TSMC)
     • Paper 2. Process Integration of Photonic Interposer for Chiplet-Based 3D Systems (CEA-LETI)
     • Paper 4. Design Space Exploration (DSE) for over-136 GB/s IO Bandwidth with LPDDR5X SDRAM Packages on SOC Package in 200 mm3 (Samsung)
     • Paper 5. 3D Stacking of Heterogeneous Chiplets on Modified FOWLP Platform with Thru-Silicon Redistribution Layer (IME/ Qorvo)
     • Paper 6. Same Size Mold Chase Technology for Effective Stack Die Architectures (Intel/Towa)
     • Paper 7. A Novel Chiplet Integration Architecture Employing Pillar-Suspended Bridge with Polymer Fine-Via Interconnect (ULVAC/Taiyo Ink/Tohoku University/Osaka University/AOI Electronics/Oume Electronics/Sumitomo Bakelite/Tokyo Tech)
   • Session 13: Wafer/Panel-Level and Advanced Substrate Technologies
     • Paper 1. Supercarrier Redistribution Layers to Realize Ultra Large 2.5D Wafer Scale Packaging by CoWoS (TSMC)
     • Paper 3. Fabrication of Two-Types Panel-Level Interposers with Fine Cu Wirings and Outstanding Electrical Reliability (Resonac)
     • Paper 5. Signal Integrity of 2-μm-Pitch RDL Interposer for High-Performance Signal Processing in Chiplet-Based System (DNP)
   • Session 21: Fine-Pitch and Intermetallic Considerations in Advanced Solder Interconnections
     • Paper 4. Heterogeneous Integration on Organic Interposer Substrate with fine-pitch RDL and 40 micron pitch Micro-bumps (IBM)
   • Session 25: Next Generation High-Performance Computing Architectures
     • Paper 1. CoWoS (-L) Architecture Evolution for Next Generation HPC on 2.5D System in Package (TSMC)
   • Session 32: Thermo-Mechanical Modelling and Characterization
     • Paper 7. Fan-Out Embedded Bridge with TSV (FO-EB-T) Package Characterization and Evaluation
       (Siliconware Precision Industries)
   • Session 33: Advances in RDL, Via, and TSV Technologies for Chiplet Integration
     • Paper 4. Ultra Fine Pitch RDL (UFPRDL) Using Polymer Dual Damascene Processing (imec)
3. ハイブリッド接合 50件
   • Session 1: Heterogeneous Chiplet Integration
     • Paper 3. Aggressive Pitch Scaling (sub-0.5 μm) of W2W Hybrid Bonding Through Process Innovations
       (AMAT/EVG)
   • Session 3: Advancements in Copper/Silicon-Oxide Hybrid Bonding
     • Paper 1. A Study on the Surface Activation of Cu and Oxide for Hybrid Bonding Joint Interface (Samsung)
     • Paper 2. Fine Pitch Die-to-Wafer Hybrid Bonding (Adeia)
     • Paper 3. Direct Die to Wafer Cu Hybrid Bonding for Volume Production (ASMPT/EVG)
     • Paper 4. Demonstration of a Wafer Level Face-To-Back (F2B) Fine Pitch Cu-Cu Hybrid Bonding with High Density TSV for 3D Integration Applications (CEA-LETI)
     • Paper 5. Cu-Cu Wiring: The Novel Structure of Cu-Cu Hybrid Bonding (Sony)
     • Paper 6. New Cu “Bulge-Out” Mechanism Supporting Sub-Micron Scaling of Hybrid Wafer-to-Wafer Bonding
       (imec)
     • Paper 7. Electrical Analysis of Wafer-to-Wafer Copper Hybrid Bonding at Sub-Micron Pitches (TEL America)
   • Session 8: Novel Reliability Test Methods
     • Paper 4. Chip Level Evaluation of Wafer-to-Wafer Direct Bonding Strength with Bending Test (Samsung)
   • Session 9: Innovations in Copper Chip-to-Wafer Bonding
     • Paper 1. Critical Challenges with Copper Hybrid Bonding for Chip-to-Wafer Memory Stacking (Micron)
     • Paper 2. Development of Copper Thermal Coefficient for Low Temperature Hybrid Bonding (AMAT)
     • Paper 3. Impact of Plasma Activation on Copper Surface Layer for Low Temperature Hybrid Bonding
       (TEL America)
     • Paper 4. Investigation of Cu-Cu Direct Bonding Process Utilized by High Porosity and Nanocrystal Structure
       (Mitsubishi Materials)
     • Paper 5. A High Throughput Two-Stage Die-to-Wafer Thermal Compression Bonding Scheme for Heterogeneous Integration (UCLA)
     • Paper 7. Towards Selective Cobalt Atomic Layer Deposition for Chip-to-Wafer 3D Heterogeneous Integration
       (Georgia Tech/UCSD)
   • Session 14: Advances in Heterogeneous Integration Bonding Technology
     • Paper 1. Characterization of 300 mm Low Temperature SiCN PVD Films for Hybrid Bonding Application
       (Intel/Evatec)
     • Paper 3. Cu Damascene Process on Temporary Bonded Wafers for Thin Chip Stacking Using Cu-Cu Hybrid Bonding (IME/AMAT)
     • Paper 4. A New Adhesive for CoW Cu-Cu Hybrid Bonding with High Throughput and Room Temperature Pre-Bonding (Mitsui Chemicals)
     • Paper 5. Low-Temperature and Pressureless Cu-to-Cu Bonding by Electroless Pd Plating Using Microfluidic System (National Taiwan University/ASE)
   • Session 19: Advances in 3D Integration and Hybrid Bonding
     • Paper 1. Thermal Improvement of HBM with Joint Thermal Resistance Reduction for Scaling 12 Stacks and Beyond (Samsung)
     • Paper 4. Reliability Performance on Fine-Pitch SoICTM Bond (TSMC)
     • Paper 5. Development of 4 Die Stack Module Using Hybrid Bonding Approach (IME)
     • Paper 6. Impact of Dielectric and Copper Via Design on Wafer-to-Wafer Hybrid Bonding (Fraunhofer ENAS)
     • Paper 7. Voids-Free Die-Level Cu/ILD Hybrid Bonding (IBM/ASMPT)
   • Session 25: Next Generation High-Performance Computing Architectures
     • Paper 5. Die to Wafer Hybrid Cu Bonding for Fine Pitch 3D-IC Applications (Samsung)
     • Paper 6. C2W Hybrid Bonding Interconnect Technology for Higher Density and Better Thermal Dissipation of High Bandwidth Memory (SK Hynix)
   • Session 27: Next Generation Wafer-to-Wafer Copper Bonding
     • Paper 1. 0.5 μm Pitch Next Generation Hybrid Bonding with High Alignment Accuracy for 3D Integration
       (TEL America)
     • Paper 2. Low Temperature and Fine Pitch Nanocrystalline Cu/SiCN Wafer-to-Wafer Hybrid Bonding
       (ITRI/ Nanya Technology)
     • Paper 3. 0.5 μm Pitch Wafer-to-Wafer Hybrid Bonding with SiCN Bonding Interface for Advanced Memory
       (AMAT/EVG)
     • Paper 4. Fine-Pitch 30 μm Cu-Cu Bonding Using Electroless Nano-Ag (ASE)
     • Paper 5. Influence of H2O in Bonding Interfaces on Bonding Strength of Plasma-Activated Bonded Silicon Oxide (Sony)
     • Paper 7. A Study on Multi-Chip Stacking Process by Novel Dielectric Polymer Adhesive for Cu-Cu Hybrid Bonding (Mitsui Chemicals)
   • Session 31: MEMS Sensor, Bio, and Advanced Interconnect Reliability
     • Paper 4. Development of High Reliability 6 μm-Pitch Cu-Cu Connections Using over-400 mm2-Large Chip on Wafer Bonding Process (Sony)
   • Session 32: Thermo-Mechanical Modelling and Characterization
     • Paper 2. Simulation of device structure impacts on bonding wave and strain in Wafer-to-Wafer Cu-Cu Hybrid Bonding (Sony)
   • Session 34: Bonding Assembly-Novel Packaging, Process, and Characterization
     • Paper 2. Contamination-Free Cu/SiCN Hybrid Bonding Process Development for Sub-μm Pitch Devices with Enhanced Bonding Characteristics (Samsung)
     • Paper 3. Integration and Process Challenges of Self Assembly Applied to Die-to-Wafer Hybrid Bonding
       (CEA-LETI/Intel)
     • Paper 4. Critical Dimension Scatterometry as a Scalable Solution for Hybrid Bonding Pad Recess Metrology (Intel/KLA)
     • Paper 5. A Study of SiCN Wafer-to-Wafer Bonding and Impact of Wafer Warpage (imec/EVG)
     • Paper 7. Impact of Thermal Annealing and Other Process Parameters on Hybrid Bonding Performance for 3D Advanced Assembly Technology (Intel/Yield Engineering Systems)
       Interactive Presentations:
     • Paper 37-1. Investigation of Cu-to-Cu and Oxide-to-Oxide Bonding (Seoul National University of Science and Technology)
     • Paper 37-6. Surface Modification on Hydrophilicity Enhancement Using NH4OH, NaOH and KOH on Fine-Pitch Low Temperature Cu/SiO2 Hybrid Bonding (National Chiao Tung University/ITRI)
     • Paper 38-6. 50 nm Overlay Accuracy for Wafer-to-Wafer Bonding by High-Precision Alignment Technologies (Nikon)
     • Paper 38-7. Multi-Stack Hybrid Cu Bonding Technology Development Using Ultra-Thin Chips (Samsung)
     • Paper 38-8. An Investigation on Particle Embedding Capability of Wafer Level Spin-on Polymer Underfill Enabling Low Temperature Bonding of Hybrid Bonding System (JSR/imec)
     • Paper 38-11. Selective Self-Assembled Monolayer for Copper Surface Protection During Plasma Activation of Hybrid-Bonded Wafers (TEL America)
     • Paper 38-15. Chip-to-Chip Hybrid Bonding with Larger-Oriented Cu Grains for μ-Joints Beyond 100 K
       (Tohoku University/JCU)
     • Paper 38-27. Novel Polymer-Based Ultra-High Density Bonding Interconnection (National Tsing Hua University/ITRI/DuPont)
     • Paper 40-4. A Thermally Friendly Bonding Scheme for 3D System Integration (TSMC)
     • Paper 40-13. Optimization of the Cu Microstructure to Improve Copper-to-Copper Direct Bonding for 3D Integration (Atotech)
     • Paper 40-22. High Temperature Storage of Cu-Cu Joints Fabricated by Highly (111)-Oriented Nanotwinned Cu (National Yang Ming Chiao Tung University)
4. その他注目論文 7件
   • Session 19: Advances in 3D Integration and Hybrid Bonding
     • Paper 2. Electrical and Thermal Analysis of Bumpless Build Cube 3D Using Wafer-on-Wafer and Chip-on-Wafer for Near Memory Computing (Tokyo Tech)
   • Session 28: Process Enhancements in 3D, FOWLP, and TSV Technologies
     • Paper 7. Next Generation Infrared (IR) Laser Debonding / Silicon Handle Technology for Precision Chiplet Technology Applications (IBM/TEL)
   • Session 30: Trends in Encapsulants and Low Dk/Df Dielectrics
     • Paper 5. Novel Photo-Definable Low Dk & Df Polyimide for Advanced Package of High Frequency Application (Toray)
     • Paper 6. Novel Low Df Thermosetting Film and Photo Imageable Film (Taiyo Ink)
   • Session 33: Advances in RDL, Via, and TSV Technologies for Chiplet Integration
     • Paper 5. Development of a Plasma Etching Process of Copper for the Microfabrication of High-Density Interconnects in Advanced Packaging (University of Sherbrooke/IBM Canada)
     • Paper 7. Fine Pitch Micro Via Interconnection with Reliable Electroless/Electric Cu Plating Layers Combined with High Power DUV Picosecond Laser for Organic Substrates (Osaka University/Okuno Chemical/Spectronix)
       Interactive Presentations:
     • Paper 38-29. Formation and 3D Stacking Process of CMOS Chips with Backside Buried Metal Power Distribution Networks (AIST/Kobe University)
• 質疑応答